Amaoe A18 Middle Layer Reballing Stencil For Iphone 16 Series
- Location: CN
- FOB Price: 1.5 ~ 5 / Piece ( Negotiable )
- Minimum Order Quantity: 1
- Supplying Ability: 100 Piece / Year
Amaoe IP16 A18 BGA Reballing Stencil for iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard CPU/font/audio/power IC /USB control IC and iPhone 16 middle layer soldering repairs. High quality BGA reballing stencil comprehensive steel mesh for iPhone 16/16 Pro Max middle layer frame/motherboard chip soldering.
Option:
1. Amaoe IP16 A18 Reballing Stencil (test version): comprehensive reballing stencil for iPhone 16/16 Plus/16 Pro/16 Pro Max.
2. Amaoe IP16 PL-012 reballing stencil (test version): for iPhone 16/16 Plus middle layer frame soldering.
3. Amaoe IP16 reballing stencil (test version): for iPhone 16 Pro/16 Pro Max middle layer frame soldering.
Please note that the iPhone 16 series reballing stencil is currently only a test version and will be modified based on the actual motherboard situation.